ag101 gaas mmic gain block specifications and information are subject to change without notice triquint semiconductor, inc ? phone +1 - 503 - 615 - 9000 ? fax: +1 - 503- 615 - 8900 ? e - mail: info - sales@tqs.com ? web site: www.triquint.com page 1 of 6 august 2012 product features ? 60 C 3000 mhz ? 14 db gain ? 2.4 db noise figure ? +32 dbm oip3 ? single +3.3 or +4.5 supply ? internally matched to 50 ? ? lead - free/green/ rohs - compliant sot - 89 package ? mttf > 10,000 years applications ? final stage amplifiers for repeaters ? mobile infrastructure ? dbs / wll / wlan / wibro ? defense / homeland security product description the ag101 is a general - purpose gain block that offers good dynamic range and low noise figure in a low - cost surface - mount package. t he combination of near - constant oip3 and low noise figure performance over frequency makes it attractive for both narrowband and broadband applications. the device combines dependable performance with superb quality to maintain mttf values exceeding 10,000 years at mounting temperatures of +85 c and is available in the environmentally - friendly lead - free/green /rohs - compliant sot -89 package. the ag101 uses a high reliability gaas mmic technology and only requires dc - blocking and bypass capacitors, and an i nductive rf choke for operation. internal matching provides a 50 ohm input / output impedance minimizing the number of required external components. the broadband mmic amplifier is well suited for various current and next generation wireless technologi es such as gprs, gsm, cdma, and w - cdma. in addition, the ag101 will work for other applications within the 60 to 3000 mhz frequency range such as fixed wireless. functional diagram rf in gnd rf out gnd 1 2 3 4 function pin no. input / base 1 output / collector 3 ground 2, 4 specifications (1) parameter units min typ max operational bandwidth mhz 60 3000 test frequency mhz 800 gain db 13 14 16 input return loss (5) db 8.5 output return loss db 20 output p1db dbm +15 output ip3 (2) dbm +28 +32 noise figure (3) db 2.4 operating current range ma 40 50 90 supply voltage v 4.5 1. test conditions unless otherwise noted: t = 25 oc, 50 ? system. 2. oip 3 measured with two tones at an output power of +2.5 dbm/tone separated by 10 mhz. the suppression on the largest im3 product is used to calculate the 3oip using a 2:1 rule. 3. noise figure can be optimized by matching the input for optimal return loss. 4. a supply voltage between 3 to 4.5v can be used for the devices. absolute maximum rating parameter rating storage temperature - 55 to +150 c dc voltage +5.5 v rf input power (continuous) +4 dbm junction temperature +160 c thermal resistance 88 c / w junction temperature for >10 6 hours mttf operation of this device above any of these parameters may cause permanent damage. typical performance (1) parameter units typical frequency mhz 900 1900 900 1900 s21 db 14 12.8 14 12.5 s11 (5) db - 10 - 9 - 10 - 9 s22 db - 27 - 22 - 28 - 19 output p1db dbm +15 +15 +14 +14 output ip3 dbm +32.5 +33.1 +32 +32.5 noise figure db 2.4 2.6 2.2 2.4 supply voltage v +4.5 +3.3 device current ma 50 48 ordering information part no. description ag101 - g gaas mmic gain block (lead - free/green/rohs - compliant sot - 89 pkg) standard t/r size = 1000 pieces on a 7 reel. not recommended for ne w designs recomme nded replacement part: tqp3m9005
ag101 gaas mmic gain block specifications and information are subject to change without notice triquint semiconductor, inc ? phone +1 - 503 - 615 - 9000 ? fax: +1 - 503- 615 - 8900 ? e - mail: info - sales@tqs.com ? web site: www.triquint.com page 2 of 6 august 2012 typical device data s- parameters (v ds = +4.5 v, i ds = 50 ma, t = 25 c, 50 ohm system) input return loss can be improved with the appropriate input matching network shown later in this datasheet. gain vs. frequency 6 8 10 12 14 16 0 500 1000 1500 2000 2500 3000 frequency (mhz) gain (db) -40c +25c +85c oip3 vs. frequency 24 26 28 30 32 34 0 500 1000 1500 2000 2500 3000 frequency (mhz) oip3 (dbm) pout = 2db/tone noise figure vs. frequency 0 1 2 3 4 5 6 0 500 1000 1500 2000 2500 3000 frequency (mhz) nf (db) s- parameters (v d = +4.5 v, i d = 50 ma, t = 25 c, calibrated to device leads) freq (mhz) s11 (db) s11 (ang) s21 (db) s21 (ang) s12 (db) s12 (ang) s22 (db) s22 (ang) 50 - 4.72 - 30.88 15.44 164.91 - 21.66 30.26 - 9.38 - 40.39 250 - 8.67 - 27.48 13.93 165.39 - 20.26 3.92 - 16.70 - 32.88 500 - 8.9 6 - 37.68 13.75 157.18 - 20.14 - 2.25 - 17.56 - 31.25 750 - 9.06 - 51.15 13.60 148.11 - 20.02 - 7.65 - 18.25 - 35.67 1000 - 9.04 - 66.87 13.47 137.91 - 19.92 - 10.63 - 19.05 - 43.62 1250 - 9.00 - 82.11 13.39 128.62 - 19.85 - 15.19 - 20.28 - 51.49 1500 - 8.89 - 97.31 13.13 118. 57 - 19.73 - 18.74 - 21.30 - 61.37 1750 - 8.74 - 112.48 12.91 109.09 - 19.56 - 23.00 - 22.57 - 73.75 2000 - 8.65 - 128.51 12.68 99.48 - 19.71 - 28.33 - 25.15 - 85.19 2250 - 8.40 - 142.86 12.48 89.94 - 19.53 - 33.37 - 27.03 - 103.19 2500 - 7.99 - 157.26 12.22 80.41 - 19.40 - 37. 91 - 28.58 - 135.19 2750 - 7.93 - 171.48 11.88 71.42 - 19.33 - 42.30 - 28.56 - 177.83 3000 - 7.47 175.92 11.53 62.05 - 19.58 - 47.37 - 28.48 153.84
ag101 gaas mmic gain block specifications and information are subject to change without notice triquint semiconductor, inc ? phone +1 - 503 - 615 - 9000 ? fax: +1 - 503- 615 - 8900 ? e - mail: info - sales@tqs.com ? web site: www.triquint.com page 3 of 6 august 2012 typical device data s- parameters (v ds = +3.3 v, i ds = 50 ma, t = 25 c, 50 ohm system) input return loss can be impr oved with the appropriate input matching network shown later in this datasheet. gain vs. frequency 6 8 10 12 14 16 0 500 1000 1500 2000 2500 3000 frequency (mhz) gain (db) -40c +25c +85c s11 vs. frequency -30 -25 -20 -15 -10 -5 0 0 500 1000 1500 2000 2500 3000 frequency (mhz) s11 (db) -40c +25c +85c s22 vs. frequency -40 -30 -20 -10 0 0 500 1000 1500 2000 2500 3000 frequency (mhz) s22 (db) -40c +25c +85c noise figure vs. frequency 0 1 2 3 4 5 6 0 500 1000 1500 2000 2500 3000 frequency (mhz) nf (db)
ag101 gaas mmic gain block specifications and information are subject to change without notice triquint semiconductor, inc ? phone +1 - 503 - 615 - 9000 ? fax: +1 - 503- 615 - 8900 ? e - mail: info - sales@tqs.com ? web site: www.triquint.com page 4 of 6 august 2012 application circuit: 800 C 2600 mhz (ag101 - pcb) c= id= 56 pf c5 c= id= 56 pf c2 l= id= 12 nh l3 c= id= 1.8e4 pf c6 l= id= 10 nh l2 f0= loss= eeff= l= z0= 1 ghz 0 3.52 170 mil 50 ohm net= "ag101" +4.5 v circuit board material: .014 fr - 4, 4 layers, .062 total thickness 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 frequency (ghz) 9 10 11 12 13 14 s21 (db) -25 -20 -15 -10 -5 0 s11, s22 (db) db(|s[1,1]|) * (r) db(|s[2,1]|) * (l) db(|s[2,2]|) * (r) reference design: 70 m hz c= 1e4 pf l= 180 nh c= 1e4 pf c= 1e4 pf l= 180 nh c= 5.6 pf net= "ag101" +4.5 v 0.04 0.05 0.06 0.07 0.08 0.09 0.1 0.11 frequency (ghz) 12 13 14 15 16 17 s21 (db) -25 -20 -15 -10 -5 0 s11, s22 (db) db(|s[1,1]|) (r) db(|s[2,1]|) (l) db(|s[2,2]|) (r) reference design: 170 mhz c= 1000 pf l= 220 nh c= 1000 pf c= 1e4 pf l= 39 nh c= 3.9 pf net= "ag101" +4.5 v 0.1 0.13 0.16 0.19 0.22 0.25 frequency (ghz) 12 13 14 15 16 17 s21 (db) -25 -20 -15 -10 -5 0 s11, s22 (db) db(|s[1,1]|) (r) db(|s[2,1]|) (l) db(|s[2,2]|) (r)
ag101 gaas mmic gain block specifications and information are subject to change without notice triquint semiconductor, inc ? phone +1 - 503 - 615 - 9000 ? fax: +1 - 503- 615 - 8900 ? e - mail: info - sales@tqs.com ? web site: www.triquint.com page 5 of 6 august 2012 reference design: 450 mhz c= 1000 pf l= 82 nh c= 1000 pf c= 1e4 pf l= 15 nh c= 1.2 pf net= "ag101" +4.5 v 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.7 frequency (ghz) 11 12 13 14 15 16 s21 (db) -25 -20 -15 -10 -5 0 s11, s22 (db) db(|s[1,1]|) (r) db(|s[2,1]|) (l) db(|s[2,2]|) (r) reference design: 800 mhz c= 100 pf l= 33 nh c= 100 pf c= 100 pf c= 1e4 pf l= 6.8 nh net= "ag101" +4.5 v 0.6 0.7 0.8 0.9 1 1.1 1.2 frequency (ghz) 10 11 12 13 14 15 s21 (db) -25 -20 -15 -10 -5 0 s11, s22 (db) db(|s(1,1)|) (r) db(|s(2,1)|) (l) db(|s(2,2)|) (r) reference design: 1900 / 2140 mhz cap id=c3 c=56 pf ind id=l2 l=33 nh cap c=56 pf cap id=c1 c=3.9 pf ind id=l1 l=3.3 nh cap c=1e4 pf tlinp id=tl1 z0=50 ohm l=150 mil eeff=3.4 loss=0 f0=2 ghz subckt net="ag101" +4.5 v 1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 2.3 frequency (ghz) 9 10 11 12 13 14 s21 (db) -25 -20 -15 -10 -5 0 s11, s22 (db) db(|s(1,1)|) (r) db(|s(2,1)|) (l) db(|s(2,2)|) (r) reference design: catv single - ended operation l= 4.7 nh c= 1.8e4 pf l= 100 nh c= 1000 pf r= 5 ohm net= "ag101" z= 75 ohm z= 75 ohm +4.5 v 0 0.2 0.4 0.6 0.8 1 frequency (ghz) 11 12 13 14 15 16 s21 (db) -25 -20 -15 -10 -5 0 s11, s22 (db) db(|s[1,1]|) (r) db(|s[2,1]|) (l) db(|s[2,2]|) (r)
ag101 gaas mmic gain block specifications and information are subject to change without notice triquint semiconductor, inc ? phone +1 - 503 - 615 - 9000 ? fax: +1 - 503- 615 - 8900 ? e - mail: info - sales@tqs.com ? web site: www.triquint.com page 6 of 6 august 2012 ag101 - g (green / lead - free sot - 89 package) mechanical i nformation this package is lead - free/green/rohs - compliant. it is compatible with both lead - free (maximum 260 c reflow temperature) and leaded (maximum 245 c reflow temperature) soldering processes. the plating material on the leads is nipdau. outli ne drawing product marking the ag101 - g will be marked with an a1g designator. an alphanumeric lot code (xxxx - x) is also marked below the part designator on the top surface of the package. a 1 will be lasermarked in the upper right - hand corn er. esd / msl information esd rating: class 1b value: passes ? 500v to <1000v test: human body model (hbm) standard: jedec standard jesd22 - a114 esd rating: class iv value: passes ? 1000v to <2000v test: charged device model (cdm) standard: jede c standard jesd22 - c101 msl rating: leve l 1 at +260 c convection reflow standard: jedec standard j - std - 020 land pattern mounting config. notes 1. ground / thermal vias are critical for the proper performance of this device. vias should use a . 35mm (#80 / .0135) diameter drill and have a final plated thru diameter of .25 mm (.010). 2. add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. mounting screws can be added near the part to fa sten the board to a heatsink. ensure that the ground / thermal via region contacts the heatsink. 4. do not put solder mask on the backside of the pc board in the region where the board contacts the heatsink. 5. rf trace width depends upon the pc board m aterial and construction. 6. use 1 oz. copper minimum. 7. all dimensions are in millimeters (inches). angles are in degrees. a1g 1 xxxx - x
|
